연성 필름 소재
Process
| Raw Material | Plating Composition | Plating Thickness | Application |
|---|---|---|---|
|
PI Film (12~25 ㎛ ) PET Film (50~125 ㎛) Copper Foil (12~70 ㎛) |
Cu Sn Ni/Au Ni/Fe |
0.5~8 ㎛ |
Mobile & Note Book Conductive Gasket EMI Shield Film Home Appliances |